Quantcast

Forum Login

feed image
Directory Reviews Cooling Reviews

Coolermaster HyperTX S775 Heatsink Review PDF Print E-mail
Article Index
Coolermaster HyperTX S775 Heatsink Review
Specifications And Test Setup
Packaging And Out Of The Box
Installation And Performance
Conclusions


Packaging:

At first glance, the standard molded plastic packaging of the Hyper TX is the most apparent. The best way to describe it is rather thin and minimalist. Cooler Master engineered the plastic. It will absorb most shipping impacts. Money spent on the product design is always preferable. It also sports the standard trademark color theme. From front to back, a single layer of cardboard has the summary information for the cooler. One cannot expect detailed intelligence on a budget cooler.
image010.jpgimage011.jpg
Getting into the plastic packaging is fairly simple and headache free. Revealed within the cardboard is a simple multilingual manual, folded like a map. The manual provides sufficient Spartan instructions for cooler installation. Very little effort is actually required, as Cooler Master decided to forgo any cross platform compatibility and used the stock Intel HSF attachment methods. The metal/spring/screw/clip setups of most third party coolers require detailed instructions. This particular Hyper TX model only supports Intel, meaning there are not multitudes of variations that need to be explained.
image012.jpgimage013.jpg
Out of the box:

When looking at the heat sink out of the packaging, it holds an air of quality. The manufacturing accuracy for the majority of the cooler is top notch. The first feature noticed was the simplistic and under engineered connections that are also used on the stock Intel HSF. The design is not without benefit. The Hyper TX does not need a back plate; therefore the average person does not need to take apart his or her entire computer. This nuisance is illustrated when supporting a massive hunk of metal that normally voids the warranty of the motherboard.
image003.jpgimage014.jpgimage015.jpg
With the stock connectors, removal and replacement of the HSF is manageable without the use of tools. The effort required is comparatively minimal. This feature is a major plus. Successfully seating the cooler on the motherboard is not so obvious to the first time user. Upon stress testing the first installation, one of the posts popped out, even though it appeared well placed. In addition, the free play in the four mounts is a little annoying. They can move around enough to make it difficult to line up all four mounting holes without ruining a dot of third party thermal paste. This is important when trying to maintain a solid contact surface without creating bubbles. With the standard thermal pad present, this isn't an issue.
image016_-_copy.jpgimage017.jpgimage018.jpg
Following the mounts, the contact surface of the Hyper TX is covered with a standard thermal pad. When the pad is removed, the surface that comes from the manufacturer is sufficient, but not the best. Machined grooves in the surface are a little on the deep side for an enthusiast's taste. Although the surface is rough, it is more than sufficient for the price range. A standard lap job would greatly improve this cooler's capacity.

Everything above the heat pipes is well done. Cooler Master soldered each component at each contact point with the heat pipes themselves. This enables good thermal transfer from each metal-to-metal contact. The fin matrix is symmetrical and looks sturdy as well.

The Hyper TX fan assembly has a glossy black finish and the look of a jet engine. The cone like center further supports the look. The surrounding support for the fan has a rim of slots to allow greater airflow. Most people will assume that the slots allow air pushed by the fan blades to escape; however, cooler master lists it as a positive feature. One more notable feature is the rubber mounts that the fan rests on. These rubber mounts greatly reduce vibrations that are the main culprit of sound production.

The shroud that covers the entire cooler stack is a thick, translucent plastic. The plastic structure directs air across the fin matrix and acts as the anchor point for the fan. It also directs air down onto motherboard components through a deflector on the opposite side of the fins. This should provide extra cooling to those ever-growing Chipset and Mosfet heat sinks. Another incredibly advantageous feature of the Hyper TX is that the shroud/fan set fits like a glove over the heat fin matrix. This allows the user to install the cooler without having the fan and bulky shroud getting in the way. Following installation, the user simply has to slip the shroud back over the fins. A single clip holds it in place.



 
© 2003-2008 Fastsilicon Media. All Rights Reserved