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| IBM Figures Out A New Way to Stack Chips |
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 Looks like IBM has figured out a method to reliably vertically stack semiconductors, eliminating significant design constraints and power use requirements when designing small computing devices. They expect to begin implementing this new technique into mobile products like cellular phones as early as next year. MSNBC Reports...In IBM’s solution, two chips are sandwiched on top of one another — the distance between them measured in microns, or millionths of a meter — and held together by vertical connections that are etched in silicon holes that are filled with metal. The vertical connections are referred to as “through-silicon-vias,” which allow multiple chips to be stacked together with greater information flow between them. IBM said its three-dimensional approach creates the possibility of up to 100 times more pathways for information, and shortens by 1,000 times the distance that information on a chip needs to travel. “This is a big step, this is a really historic move,” said David Lammers, director of WeSRCH.com, a social networking Web site for semiconductor enthusiasts and part of VLSI Research Inc. Add this page to your favorite Social Bookmarking websites           
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